High Brightness LED (“HB-LED”) usage is increasing for new applications as manufacturing costs decrease and performance improves. HB-LED applications such as mobile phone LCD screens and keypads and flashlights for camera phones have been the drivers for HB-LED manufacturing market growth in the last couple of years, as well as car headlights, LCD TV backlights and traffic signaling. HB-LED’s typically are used for high-end applications, making quality control imperative. Our ICOS LED wafer inspector offers outgoing automated visual inspection of HB-LED wafer manufacturing for quality of the wafer surface.

LED Wafer Inspection

• ICOS WI-2220 LED Wafer Inspection System:: High sensitivity inspection of critical LED wafer manufacturing defects with low cost of ownership to support cost per lumen goals
• ICOS WI-22xx Series LED Wafer Inspection System: Automated optical inspection and metrology of microelectronic devices on a variety of wafer substrates, surface inspection, and 2D bump inspection

Defect Inspection
MOCVD Process Control

• Candela 8620 LED Defect Inspection: Enabling improved substrate surface metrology and epi process control with high sensitivity to yield-limiting defects
• Candela CSxx: Defect inspection and classification systems for compound semiconductor and optoelectronic materials
• ICOS WI-2280: Next-generation inspection capabilities and flexibility for LED applications.

Data Management and Analysis

• KLARITY LED: Automated LED wafer manufacturing defect analysis of inspection results for LED yield enhancement

Surface Metrology
Stylus Profiling

• P-Series: Benchtop stylus profilers for production applications
• HRP-250: Stylus-based 200mm surface topography metrology system